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Copper bonding wire in semiconductor devices
Copper bonding wire in semiconductor devices as a connection material between chip and the outside of the main circuit with excellent mechanics Properties. Electrical properties 101 IACS. And the second bondingspot stabilityStrict guaranteeing Preparation about YSC single crystal copper bonding wire with bright. Clean surface. And stability performance into a ball
Uniform columnar crystal organizational guaranteed the YSC single crystal copper bonding wire to had not been Oxidized
Bonding Wire
